As we discussed earlier this week, the manufacturing process has now begun. We wanted to give you another update about how things are going.
We're currently working on the Surface-mount Technology (SMT) stage, and are in the verification stage. We'll be following up with the Dual in-line package (DIP) next week, which will be followed by assembly, MP testing, and then packaging and shipping.
The SMT machine.
Our partner engineer making the verification tool which will be used to verify the hardware signal of the PCBA board after DIP finishes.
Things are going according to schedule so far, and we'll continue to update you with more news about manufacturing next week.
Have a great weekend,
Update: July 17, 2020